Next Generation RF Front End Module
Revolutionary density meets uncompromising performance through chipletization.
Mercury’s RFFE‑MCP‑TR‑001 is an X‑Band Front End Module built on an ultra‑compact SiP architecture that provides high functional density and SWaP‑c‑optimized configurability across all production scales. With its Multi‑Chip Package design, it enables rapid modification cycles that reduce development time and cost.
Sized for Attritable platforms and scalable to AESA apertures, the module delivers substantial density improvements while maintaining advanced SoC‑class RF performance. The MCP architecture supports accelerated development through shortened prototype‑verification loops and efficient transition to medium‑volume manufacturing.
Developed entirely within Mercury, the design allows full customization at every layer, ensuring precise alignment with mission‑specific requirements
Agile Signal Conditioning at the Edge
4
Channel
8-12
X-Band (GHz)
28mm
Front-end subsystem
Purpose-Built Architecture, Accessible Design
This new architecture’s internal chipletization enables rapid prototyping and efficient validation of custom design variations, supporting a wide range of system requirements. Unlike traditional SoC approaches, the Multi‑Chip Package structure allows faster more cost‑effective updates and the integration of surrounding components directly into the SiP, further reducing system size and improving overall performance. This approach strengthens the role of the module as both a high‑density Front End Module and a mission‑flexible Signal Conditioner.
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OPEN SYSTEM ARCHITECTURES
Accelerate Technology Adoption from RF to Digital
The pace of today's technology development means the traditional approach of custom-designed components, modules and subsystems is too slow. By adopting a modular open systems architecture approach (MOSA), we deliver the latest capabilities at the speed of relevance.
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