RF-MCP

Next Generation RF Front End Module

Revolutionary density meets uncompromising performance through chipletization.

Mercury’s RFFE‑MCP‑TR‑001 is an X‑Band Front End Module built on an ultra‑compact SiP architecture that provides high functional density and SWaP‑c‑optimized configurability across all production scales. With its Multi‑Chip Package design, it enables rapid modification cycles that reduce development time and cost.

Sized for Attritable platforms and scalable to AESA apertures, the module delivers substantial density improvements while maintaining advanced SoC‑class RF performance. The MCP architecture supports accelerated development through shortened prototype‑verification loops and efficient transition to medium‑volume manufacturing.

Developed entirely within Mercury, the design allows full customization at every layer, ensuring precise alignment with mission‑specific requirements