Boards:
Single Board Computers:
6U OpenVPX SBC powered by an 2nd Gen Intel® Core™ i7 processor with FPGA coprocessor, Ethernet switch fabrics and dual mezzanine sites
VX6-200CC Dual Dual-Core Xeon® VXS Conduction-Cooled Single-Board Computer
VX6-200R Dual Dual-Core Xeon® VXS Air-Cooled Single-Board Computer
High Density Processor Module for Mobile Platforms
Freescale®-Based 6U VME64x Single Board Computer
6U OpenVPX SBC powered by an Intel® Core™ i7 processor with FPGA coprocessor, Ethernet switch fabrics and dual mezzanine sites.
Processor Module Enables Full Signal and Image Processing Close to the Sensor in Mobile Platforms
Secure 6U OpenVPX single board computer powered by Intel 3rd Generation Core i7 processing technology
3U OpenVPX single board computer powered by Intel 3rd Generation Core i7 CPU includes 8 GB DDR3, PCIe 2.0, 2x GbE, CANbus, DVI/HDMI, VGA, USB, audio, and SATA
Dual MPC7448 CPU w/ AltiVec, up to 1024 MB DDR ECC, RACE++, 9U config: 7x MPC7448, 1x RINOJ-F-2.5
SBC4120 SWaP-optimized 6U VME SBC with MPC8640D w/ AltiVec, I/O, VME 2eSST, 2x PMC/XMC PCIe/PCI-X interfaces plus open software environment.
Duo Core 6U VMEbus Computer
High Performance, Low Cost PMC 2-D Graphics Adapter with Dual-Display Support
3U VPX Graphics Processor with AMD E4690 GPU
High Performance, Low Cost PMC 2-D Graphics Adapter with Dual-Display Support
3U VPX XMC/PMC Carrier Module
3U VPX Single Board Computer Utilizing the Intel® Arrandale Core™ i7 CPU
TSBCi7-340X Single Board Computer (SBC)
3U VPX RAID Controller Module
3U VPX SAS, SATA, or PCI Express Mass Storage Drive Module
Hot-swappable cPSB Compliant 650 MHz UltraSPARC IIe Performance
Themis USPIIe-USB Single-Board Computer
Themis USPIIIi High-Performance Multiprocessing VME Computers
Embedded board level computing
Embedded board level computing
LDS6521 VPX-REDI, rugged, SWaP-optimized 6U OpenVPX SBC with Intel 2nd Gen Core i7 CPU, I/O, AVX2, 8 GB DDR3 ECC, PCIe 2, POET FPGA/10 GbE fabrics, IPMI, and MCP & 2x mezz sites for data/image processing
HCD5220 VITA 41, rugged, SWaP-optimized 6U SBC with 2x MPC8641D w/ AltiVec, up to 4 GB DDR2, I/O, VME 2eSST, 2x PMC/XMC, I2C, AC, and MCP for efficient processing
HCD6220 VPX-REDI, rugged, SWaP-optimized 6U SBC with 2x MPC8640/8641D, up to 4 GB DDR2, Serial RapidIO, GbE, 2x PMC/XMC, I2C, MCP and an open SW environment for portability ease
HCD6410 VPX-REDI 6U SBC with 4x dual-core MPC8640D CPU, AltiVec, 8 GB DDR2, 128 MB flash, Serial RapidIO, PCIe, GbE, I/O, mezz, IPMI over I2C and MCP for high-end digital signal processing
Avionics Single Board Computers:
PrPMC/PMC Air-cooled Freescale QorIQ P2 processor module
Intel Core™ i7 Gen 5 Processor XMC
Freescale QorIQ™ P3041 Conduction-cooled Single Board Computer XMC Module
Freescale® QorIQ® P2 6U VME64x Single Board Computer (SBC)
The CIO5-2040 is a 6U OpenVPX™ single board computer integrating two 5th Generation Intel® Core™ i7 processors. It is designed for the most demanding networking, computing application deployed in space-constrained environments requiring conduction-cooled equipment. With six SATA III, four Gigabit Ethernet and four 10GbE, it offers high data throughput to access storage and communicate over Ethernet.
The CIOV-2231 single board computer, powered by an Intel® Core™ i7 processor with an embedded Iris® Pro Graphics 6200 GPU, delivers OpenCL high-performance functionality. Its 16 GB of DDR3 ECC and up to 32 GB of on-board SATA flash memory enable the processing and storage of large amounts of data, making the CIOV-2231 ideally suited for processing intensive data/graphics applications in harsh environments.
The MFCC-8570 is an XMC mezzanine powered by a 5th Generation Intel® Core™ i7 quad-core, dual-threaded (8-threads) processor (Broadwell microarchitecture). Protected for rough deployment within a rugged conduction-cooled package, these mezzanines are ideally suited to data/graphics-intensive applications in harsh environments.
The RIO6-8093 is a 6U VME single board computer for air-cooled ground applications. It provides a PCI connection over the VME-P0 connector enabling VMEbus offload operations. FlexIO™ is placed between the different I/O sources and the backplane connector. Combined with the onboard FPGA-based PCIe® to VME bridge, FlexIO makes the RIO6-8093 an ideal upgrade solution to legacy ground applications.
The RIO6-8092 is 6U VME Power Architecture single board computer. It combines a fast dual-core processor with advanced interconnect high-speed links and bridges (PCIe®, Gigabit Ethernet), and a user-programmable FPGA for application development. The RIO6-8092 is the ideal solution to bring a technology refresh to airborne applications.
The RIOV-2478 is a 3U OpenVPX™ single board computer for airborne applications requiring conduction cooling. It combines a multi-core processor with advanced interconnect high-speed links and an onboard crosspoint switch. The crosspoint switch has payload profile flexibility to support of PCIe®, GbE and 10GbE over OpenVPX and XMC architectures.
The RIOV-2473 is a 3U OpenVPX™ single board computer that combines a multi-core processor with advanced interconnect high-speed links and an onboard crosspoint switch. The crosspoint switch enables flexibility of the payload profile configuration in accordance with OpenVPX, that allows support of PCIe®, GbE and 10GbE.
Multiprocessing:
Rugged AdvancedTCA dual Xeon (Haswell) processing blade with AMC mezzanine site
Rugged AdvancedTCA dual Xeon (Haswell) processing blade with FPGA acceleration and mezzanine
Rugged AdvancedTCA dual Xeon (Haswell) processing blade with FPGA acceleration
6U OpenVPX multiprocessing server blade powered by dual Intel® Xeon® processors (formerly code named "Jasper Forest") with Ethernet switch fabrics
HDS6601 SWaP-optimized, rugged 6U OpenVPX multiprocessor with dual Intel Xeon 8-core server-class CPUs, POET fabric bridge, 32 GB DDR3, Serial RapidIO, 10 GbE, PCIe Gen3, and MultiCore Plus software
SWaP-optimized, rugged 6U OpenVPX multiprocessor with dual Intel Xeon 10-core CPUs, 128 GB DDR3, 40 GbE/InfiniBand, PCIe Gen3, MOTS+ protections and Gen 4 BuiltSECURE SSE IP.
Accelerators:
Module Exploits the Power of FPGAs in Ensemble 7100 Platforms
Module Exploits the Power of FPGAs in PowerStream® 7000 Systems
GPU, Video & Graphics Boards:
Ensemble 6000 Series 6U OpenVPX GSC6200 GPU Processing Module
6U OpenVPX GPGPU coprocessing board features dual NVIDIA Fermi MXM GPUs with 480-cores, 864 GFLOPS, 4 GB GDDR5, 4x DisplayPorts, 2x VGA, PCIe, and StreamDirect in a VPX-REDI FF
6U OpenVPX GPGPU coprocessing board features dual AMD Radeon MXM GPUS, up to 2560-cores, 4 TFLOPS, 4 GB GDDR5, 4x DisplayPort, 2x VGA, front panel I/O options, PCIe 2.0, and StreamDirect in a VPX-REDI FF
H.264/AVC Codec PMC/XMC Module
3U OpenVPX™ low-latency frame grabber module for safety-critical video applications
XMC frame grabber board that combines hard real-time video capture in parallel for two video channels
data
3U OpenVPX™ high-performance avionics GPU board built for airborne applications requiring DO-178C/DO-254 certification
Network Switches:
Serial RapidIO®/GigE Connectivity and Extreme Performance Module
RapidIO® Connectivity and Extreme Performance Module
Rugged AdvancedTCA 40 Gb/s Ethernet or InfiniBand switch
A rugged, tactical 10/16 port Gigabit Ethernet switch designed for space-constrained environments
SFM6100 rugged, 6U OpenVPX networking L2 managed switch delivers 19x inter-board Serial RapidIO @ 3.125 Gbaud, 20x GbE connections, 12V, front I/O, and sys. mgmt to support 18 VPX payload modules @ 1.25 GB/s
SFM6101 rugged, 6U OpenVPX networking board provides Gen2 SRIO and GbE data and control plane switching and chassis management capabilities in AC/CC variants.
SFM6102 rugged, 6U OpenVPX networking L2 managed switch delivers 24x 10GbE @ 3.125 Gbaud, 20x GbE Ethernet data & control planes switching along with front I/O, sys. mgmt for net-centric processing and control applications
SFM5100 rugged, 6U VXS network L2 managed switch board provides 21x Serial RapidIO/GbE @ 3.125 Gbaud switching, 19x GbE, 5V, front I/O, and system management for dispersal of TCP/IP traffic
Input/Output Boards:
ARINC 429 PMC Mezzanine
6U VME64x PMC/XMC Carrier Board
6U VME64x PMC Carrier Board
6U VME64x PMC Carrier Board
Serial I/O PMC module
XMC mezzanine multi-mode I/O interface boards with sFPDP and serial RapidIO interface
IOM-141 Streaming multi-mode I/O XMC mezzanine with serial RapidIO / Race++ interfaces enhances system performance and flexibility with high speed and connection density for real-time sensor input or data output
Storage:
Flash disk XMC for embedded and avionics applications
Software:
Eclipse-Based IDE Extended to Support Multicomputer Development
Mercury’s Open MPI on Serial RapidIO®
Multi-Fabric Open-Standard Connectivity Tool Optimizes Flexibility, Portability, and Performance
High-Performance, Packet-Based Interconnect Technology
System-Level Performance Analyzer
End-to-end simulation and verification tool for FPGA-based systems
FPGA board development IP and software API for control and integration
Chassis & Subsystems Pre-integration:
Integrated System Designed for Performance and Built for Deployment
A High-Performance and Environmental Configurable Storage Solution
Displays and Sensors:
Rugged, 12.1″ portrait, XGA smart multi-function display (SMFD) with a 4th generation Intel i7 processor.
Dual Long-Wave Infrared Sensor that automatically blended high-definition long-wave infrared (LWIR) and low-light visible sensor imagery, offering excellent situational awareness.
Solid State Drives (SSDs)
FIPS 197, 256/512GB, SATA SLC, secure solid state drive (SSD)
FIPS 197, 64GB, SATA BGA SLC NAND Flash, secure, encrypting, solid state drive (SSD)
FIPS 197, FIPS-140-2 and optional - CSfC eligible 128/256GB solid state drive (SSD)
Rugged Servers:
RES XR3 Servers:
1U, single socket, 17 inch depth, rugged rack server
1U, dual socket, 17 or 20 inch depth, rugged rack server
2U, single socket, 17 inch depth, rugged rack server
2U, dual socket, 17 or 20 inch depth, rugged rack server
3U, single socket, 17 inch depth, rugged rack server
3U, dual socket, 17 or 20 inch depth, rugged rack server
2U, single socket, 13 inch depth, rugged rack server
2U, dual socket, 13 or 17 inch depth, rugged rack server
3U, dual socket, 13 or 17 inch depth, rugged rack server
Themis’ Rugged, Rackmountable, 3RU Dual UltraSPARC IIIi Server
RES XR4 Servers:
RES-XR4 1U dual socket, 17 or 20 inch rugged rack server
RES-XR4 1U, 3-slot, dual socket, 20 inch rugged rack server
RES-XR4 2U, dual socket, 17 or 20 inch rugged rack server
RES-XR4 3U, dual socket, 17 or 20 inch rugged rack server
RES-XR4-3U-16D rack mountable server
RES-XR4-2U-FIO dual socket, 13.5 or 16.5 inch rack mountable server
RES-XR4-3U-FIO dual socket, 13.5 or 16.5 Inch rack mountable server
RES XR5 Servers:
20” depth, 1U, front I/O rugged fanless server
20” depth, 2U, front I/O rugged fanless server
21” depth, 3U, rear I/O rugged GPU server
RES XR6 Servers:
RES-XR6 1U, 18" depth, 1 drive, front I/O rugged rack server
RES-XR6 1.5U, 18" depth, 10 drive, rear I/O rugged rack server
RES-XR6 2U, 17" depth, 5 drive, front I/O rugged rack server
RES-XR6 2U, 18" depth, 24 drive, rear I/O rugged rack server
RES AI 3U, 20" depth, 4 drive, rear I/O high performance computing (HPC) rugged rack server
RES AI 3U, 20" depth, 16 drive, rear I/O high performance computing (HPC) rugged rack server
RES AI 3U, 20" depth, 4 drive, rear I/O high performance computing (HPC) rugged rack server
RDP Servers:
RDP-B02-1U, 20" depth rugged rack server with NVIDIA GPU and DPU and 100 GbE networking
Compact and Small Servers:
Lightweight, low power, high density rugged server with 12 module bays to achieve optimum performance and precise functionality by mixing over five module types
9 lb, low-power rugged solution for space-constrained mission-critical applications
Small Form Factor Systems:
NanoX/VITA-74 NanoATR SYSTEM
NanoPAK i7 Small Form Factor Computer Datasheet
NanoPAK Small Form Factor Computer Datasheet
RES-mini Small Form Factor Server Datasheet
NanoPAK i7 Small Form Factor Computer with Intel 6th Generation Core™ i7 Processor Datasheet
VPX Systems:
3U VPX, 8-Slot, Preconfigured System