RES AI XR6 2U, 8 Drive 21 Inch Rugged GPU Server

Dual Intel® Xeon® Scalable processors, 2 double-wide NVIDIA GPUs, 3TB memory and 8 disk drives

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Compact 21 Inch Deep, Rear I/O Supercomputer

Built from the ground up to provide edge computing capability previously reserved for the datacenter, Mercury’s RES AI 2U supercomputing server packs dual Intel® Xeon® Scalable processors, two double-wide NVIDIA Tesla GPUs, 3TB DDR4 ECC memory and 240TB of storage in a compact 30lb server form-factor. 

DOWNLOAD RES AI XR6 2U, 8 DRIVE 21 INCH DATASHEET

CONFIGURE YOUR SERVER

Features

 

  • Up to two NVIDIA® Tesla® GPGPUs or Quadro® GPU
  • Dual Intel® Xeon® Scalable CPU with up to 26 cores per processor 
  • Up to 3TB DDR4 ECC memory
  • Up to 240TB of storage with eight 2.5" front-access disk drives (SAS3, SATA or NVME)
  • 4 PCIe 3.0 cards
  • MIL-STD: 810G
  • Customizable with U.S. designed and manufactured motherboards and advanced security features
Specifications
  • Dual Intel® Xeon® Scalable CPUs with up to 26 cores per processor
  • Up to 2 double-wide NVIDIA Tesla or Quadro GPU accelerators
  • Up to 3TB with 12 DIMM slots, 2933MHz RDIMM/LRDIMM

Management and Operating System

  • Windows®, Linux®, VMware® and other hypervisors
  • IPMI v2.0, Redfish option available
  • TPM 1.2 or 2.0 support
  • Optional LSI3108 SAS Controller Mezzanine

Expansion and Modular Maintainability

  • 2 Disk on Module (up to 128GB per DOM)
  • 2 USB 3.0 (internal)
  • 4 PCIe 3.0 Cards:
    • 2 PCIe 3.0 x16 GPU (double width, FHFL) slots
    • 2 PCIe 3.0 x16 (single width, FHHL) slots

Power Supply Options

  • Single or Redundant 100/240V VAC (47/63Hz, 400Hz)
  • Single or Redundant 10-36 VDC, 32 Amps
  • Single or Redundant 36-72 VDC, 18 Amps
  • MIL-STD 461

Input/Output Versatility

Front Access

  • 8 removable, hot pluggable, 2.5” SATA/SAS3 drives
  • 1 power switch

Rear Access

  • 2 10GBaseT Ethernet Ports (RJ45)
  • 4 USB 3.0
  • 1 IPMI 2.0
  • 1 VGA graphic Port

Additional Options

  • Shock pins
  • Front door filter
  • Slide rails 

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Environmental & Mechanical

Environmental*

Operating

  • Temperature: 0°C to 50°C
  • Extended temperature: -15°C to 65°C
  • Humidity: 8% to 95% (non-condensing)
  • Shock: 3 axis, 35g, 25ms
  • Vibration: 4.76Grms, 10Hz to 2000 Hz (SSD)

Non-Operating

  • Temperature: -40°C to 70°C
  • Humidity: 5% to 95% (non-condensing)


Mechanical

  • Height: 2U or 3.5 inches (88.9mm)
  • Width: 17 inches (433.3mm)
  • Depth: 21 inches (533mm)
  • Weight (Typical)*: 30 pounds (13.6kg)
  • 19” rackmountable

* Mercury Systems designs all products to meet or exceed listed data sheet specifications. Some specifications including I/O profiles, weight, and thermal profiles are configuration dependent. Contact Mercury for information specific to your desired configuration requirements.

Configurable to your HPC Field Application

Equipped with 4 PCIe 3.0 slots that accommodate a mix of GPUs, FPGA accelerators and other expansion cards, RES AI 2U maximizes scalability and minimizes the overall computing footprint to accelerate an array of high performance computing (HPC) workloads in the field. Eight hot-pluggable, front-access drives support the latest 2.5", 15mm high SAS3, SATA and NVME drives. 

To ensure availability and sustained optimal performance in almost any environment, our 2U server features dual redundant, hot swappable AC or DC power supplies and is certified to MIL-STD 810G.  

Maximize Throughput with Parallel Computing

Powered by the latest NVIDIA® Volta architecture GPUs, RES AI 2U harnesses parallel processing to maximize throughput, boost productivity and push the boundaries of compute-heavy  mission-critical applications such as signal intelligence (SIGINT), cryptography, deep learning, artificial intelligence (AI), surveillance, sensor fusion, visualization, image processing, tracking and big data analytics. Other GPU options are available. 

Scale Supercomputing Applications from the Cloud to the Edge

Compatible with multiple operating systems, applications and software, RES AI adheres to open standards and integrates the latest commercial technologies to support supercomputing from the cloud to the edge. 

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